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BONDING 168

The latest bonding machine developed by CEDATEC has been designed with the most advanced 8G Induction bonding system which provides a bonding strength and capacity of more than 50% along with a low-power consumption.

This new-generation machine does not have any limitation on the layer number it can handle.

The Bonding machine makes the coupling of the various layers to be processed in any Hot Press.

It uses a template where the layers are held in a precise position by pins.

The layers will be stuck together by 4 pairs of welder heads acting like pliers to grip the layers and fuse the resin in small peripheral areas of prepreg while they are pressing.

For more information, ask for the datasheet pdf

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