In order to reduce the problems incurred in the production of complex PCB’s, CEDATEC has developed a new laminating system. Dry-film is laminated by means of heated rollers with a diameter of 130 mm (5”).

This system can laminate successfully even onto surfaces with high porosity.

• The AC 80 is identical to the AC 130 with these exceptions:
• Maximum board width is 610 mm (24”).
• Lamination rollers are 80 mm diameter vs. 130 mm.
• Structural metal is less massive due to the shorter width of lamination.
• Lamination roller air pressure cylinders are smaller due to smaller rollers.