System Evolution

211/T

NEVER STOP INNOVATING IMPROVING

OPTICAL PINLESS 211/T

Strong of the success of his Bonding Machines, CEDATEC srl has introduced in the market the most advanced multilayer registration technology called PINLESS. It adopts a CCD Optical feature along with the new Thermal Bonding System (TBS) providing several advantages such as:

  • No limits on layers number.
  • No need for post etching punching/drilling layer.
  • No need for dedicated tools for inner layers registration and lamination press thus less manpower.
  • Eliminates all the mechanical tolerances related to the pin-lam system.
  • Welding up to 8 mm multilayer thick.
  • Welding up to 8 mm multilayer thick.
  • Very tight layer to layer registration accuracy of +/- 20 µm (+/- 0.75 mil).
  • Small machine footprint.

First section: Loading pre-build up area.

Second section: Layer loading with CCD camera and TBS welding system.

For more information, ask for the datasheet pdf

Related products

BONDING 168

BONDING 188

PINLESS 211-8

PINLESS 258-8

PINLESS 211-B

© 2019 Cedatec srl - P. Iva IT03606730129

211/B

NEVER STOP INNOVATING IMPROVING

OPTICAL PINLESS 211/B

Strong of the success of his Bonding 130, CEDATEC srl has been the first company which introduced the well-known technology called Pinless.
This single-drawer machine with Optical Registration System combined with the Induction welding provides several benefits such as:

  • No need for post etching punching/drilling layer.
  • No need for dedicated tools for inner layers registration and lamination press. Less manpower.
  • Welding up to 8 mm multilayer thick.
  • Very tight layer to layer registration accuracy of +/- 20 µm (+/- 0.75 mil).

All inner layers should have areas for welding operation which can be either a dedicate spot or any position along the layer copper frame.

First section: Layers pre-build up.

Second section: Layer loading with CCD camera and welding system.

For more information, ask for the datasheet pdf

Related products

BONDING 168

BONDING 188

PINLESS 258-8

PINLESS 211-8

PINLESS 211-T

© 2019 Cedatec srl - P. Iva IT03606730129

258/8

NEVER STOP INNOVATING IMPROVING

OPTICAL PINLESS 258/8

Strong of the success of his Bonding Machines, srl has been the first company which introduced the well-known technology called Pinless.

This double-drawer machine with Optical Registration System combined with the Induction welding provides several benefits such as:

  • No need for post etching punching/drilling layer.
  • No need for dedicated tools for inner layers registration and lamination press.
  • Welding up to 8 mm multilayer thick
  • Very tight layer to layer registration accuracy of +/- 20 µm (+/- 0.75 mil)
  • Energy saving being the welding heads active only during the bonding action
  • Less manpower.

All inner layers should have areas for welding operation which can be either a dedicated spot or any position along the layer copper frame.

First section: Loading pre-build up area.

Second section: Optical alignment and welding areas.

For more information, ask for the datasheet pdf

Related products

BONDING 168

BONDING 188

PINLESS 211-8

PINLESS 211-T

PINLESS 211-B

© 2019 Cedatec srl - P. Iva IT03606730129

211/8

NEVER STOP INNOVATING IMPROVING

OPTICAL PINLESS 211/8

Strong of the success of his Bonding Machines, CEDATEC srl is introducing in the market the most advanced OPTICAL multilayer registration technology called Pinless.

This is a single drawer machine with CCD registration system.

This single-drawer machine with Optical Registration combined with the worldwide patented Induction welding System provides several advantages such as:

  • No need for post etching punching/drilling layer.
  • No need for dedicated tools for inner layers registration and lamination press. Less manpower.
  • Eliminates all the mechanical tolerances related to the pin-lam system.
  • Welding up to 8 mm multilayer thick.
  • Very tight layer to layer registration accuracy of +/- 20 µm (+/- 0.75 mil).

All inner layers should have areas for welding operation which can be either a dedicate spot or any position along the layer copper frame.

First section: Loading pre-build up area.

Second section: Layer loading with CCD camera and Welding system.

For more information, ask for the datasheet pdf

Related products

BONDING 168

BONDING 188

PINLESS 211-T

PINLESS 258-8

PINLESS 211-B

© 2019 Cedatec srl - P. Iva IT03606730129