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The VLP provides much better overall material quality along a huge energy and electricity savings.
Therefore, it helps on reducing the carbon dioxide (CO2) emissions that are due to the burning of fossil fuels
for electricity generation.
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NEVER STOP INNOVATING IMPROVING
CEDATEC supplies any kind of AL roll dimension and thickness in use for few different applications on VLP and/or Adara press such as smart-card, solar etc.
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CEDATEC supplies the original Air Bag which has been developed for standing many hot cycles of VLP, Monolam and Adara press.
Air Bag made by a special and stronger material for high-temperature and high-pressure are also available.
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Specially designed for any today needs, Cedatec has developed the NEW GENERATION Vacuum-Lamination-Press VLP 7300 that combines the revolutionary endothermic system for heating up the material along with the innovative heating element technology for keeping top and bottom material temperature uniform.
The pressure is applied by an air-booster system which guarantees a perfect material thickness and planarity.
Heating profile, Pressure, Vacuum and all other lamination process are controlled by the most advanced interface by Smart software and Touch-Screen.
Historical cycles data can be stored on the computer or network.
Material quality improvement is evident same as well the cost saving which allows the VLP 7300HL to be the most advanced Press in the market.
New Software platform Cedatec System© with centralized data-collection (Industry 4.0 complies)
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This remarkable new product has been made a reality thanks to an advanced heat-resistant fiber developed through years of expertise and technology in the manufacture of high quality felt for paper making.
Cushion BOARD is the perfect answer for the more efficient manufacture of higher quality PC board products.
Cushion pad of 400°C (750F) are also available
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NEVER STOP INNOVATING IMPROVING
NEVER STOP INNOVATING IMPROVING
The Lay-up machine handles automatically the copper rolls in order to have a perfect material build up. An Elidust laminar flow with electrostatic discharge system guarantees a perfect cleanness of the area. The Lay-up may also handle separator plates, prepreg and core automatically during the cycle.
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Strong of the success of his Bonding Machines, CEDATEC srl has introduced in the market the most advanced multilayer registration technology called PINLESS. It adopts a CCD Optical feature along with the new Thermal Bonding System (TBS) providing several advantages such as:
First section: Loading pre-build up area.
Second section: Layer loading with CCD camera and TBS welding system.
