211/8

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OPTICAL PINLESS 211/8

Strong of the success of his Bonding Machines, CEDATEC srl is introducing in the market the most advanced OPTICAL multilayer registration technology called Pinless.

This is a single drawer machine with CCD registration system.

This single-drawer machine with Optical Registration combined with the worldwide patented Induction welding System provides several advantages such as:

  • No need for post etching punching/drilling layer.
  • No need for dedicated tools for inner layers registration and lamination press. Less manpower.
  • Eliminates all the mechanical tolerances related to the pin-lam system.
  • Welding up to 8 mm multilayer thick.
  • Very tight layer to layer registration accuracy of +/- 20 µm (+/- 0.75 mil).

All inner layers should have areas for welding operation which can be either a dedicate spot or any position along the layer copper frame.

First section: Loading pre-build up area.

Second section: Layer loading with CCD camera and Welding system.

For more information, ask for the datasheet pdf

Related products

BONDING 168

BONDING 188

PINLESS 211-T

PINLESS 258-8

PINLESS 211-B

© 2019 Cedatec srl - P. Iva IT03606730129

188

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BONDING 188

The latest double-drawer Bonding machine mod CEDATEC 188 developed by has been designed with the most advanced 8G Induction bonding system which provides a bonding strength and capacity of more than 50% along with a low-power consumption.

This new-generation machine provides 4 welding areas for each long panel side for a total of 8 points.

It does not have any limitation on the layer number it can handle.

The Bonding machine makes the coupling of the various layers to be processed in any Hot Press.

It uses two templates where the layers are held in a precise position by pins.

The layers will be stuck together by 4 pairs of welder heads acting like pliers to grip the layers and fuse the resin in small peripheral areas of prepreg while they are pressing.

For more information, ask for the datasheet pdf

Related products

BONDING 168

PINLESS 258-8

PINLESS 211-8

PINLESS 211-T

PINLESS 211-B

© 2019 Cedatec srl - P. Iva IT03606730129

168

NEVER STOP INNOVATING IMPROVING

BONDING 168

The latest bonding machine developed by CEDATEC has been designed with the most advanced 8G Induction bonding system which provides a bonding strength and capacity of more than 50% along with a low-power consumption.

This new-generation machine does not have any limitation on the layer number it can handle.

The Bonding machine makes the coupling of the various layers to be processed in any Hot Press.

It uses a template where the layers are held in a precise position by pins.

The layers will be stuck together by 4 pairs of welder heads acting like pliers to grip the layers and fuse the resin in small peripheral areas of prepreg while they are pressing.

For more information, ask for the datasheet pdf

Related products

BONDING 188

PINLESS 258-8

PINLESS 211-8

PINLESS 211-T

PINLESS 211-B

© 2019 Cedatec srl - P. Iva IT03606730129

MLP 62M

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MLP
62M

Specially designed for any today needs, the new MONOLAMINATION MLP 62M combines the high temperature accuracy of the two hot platens that heating up the stack, along with the pressure system made by an air-booster which guarantees a perfect material thickness and planarity.
The high temperature of 400°C (750F) is an optional that allow to process any material available nowadays in the market.
Material quality improvement is evident same as the cost saving which bring the MLP 62M the most advanced Press available in the market.
Heating profile with Pressure, Vacuum and all other cycle parameters are controlled by PLC and Touch-Screen.
New Software platform Cedatec System© with centralized data-collection is also available (Industry 4.0 complies).

  • Best material quality

  • High dimensional stability

  • High temperature accuracy

  • Improves overall quality

  • Running cost saving

  • Small footprint

For more information, ask for the datasheet pdf

Related products

VLP 4800M

VLP 5200/5700S

VLP 7300H

VLP 7300HL

MLP 25M

© 2019 Cedatec srl - P. Iva IT03606730129

MLP 25M

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MLP
25-M

The MONOLAMINATION PRESS MLP 25M is a single-opening Press which uses two stages heated through electical resistance.
By this system each layer of the stack is uniformly heated following the heating profile in use.
Heating, Pressure & Vacuum are controlled by a Touch Panel.
The pressure on the stack is applied by a free-floating plate and it guarantees an high thickness accuracy and pressure distribution throughout the stack.

  • Flexibility (in about 45 minutes from inner-layer to drilling) Temperature rise up to 11°C/min (with specific conditions)

  • Fast cycle time

  • Small footprint

  • Low energy consumption

  • Improves overall quality

  • Less material stress

For more information, ask for the datasheet pdf

Related products

VLP 4800M

VLP 5200/5700S

VLP 7300H

VLP 7300HL

MLP 62M

© 2019 Cedatec srl - P. Iva IT03606730129

VLP 5200/5700S

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Green Technology

VLP
5200 5700S

Specially designed for any today needs, Cedatec has developed the NEW GENERATION Vacuum-Lamination-Press VLP 5200-5700S that combines the revolutionary endothermic system for heating up the material along with the innovative heating element technology for keeping top and bottom material temperature uniform.
The pressure is applied by an air-booster system which guarantees a perfect material thickness and planarity.
Heating profile, Pressure, Vacuum and all other lamination process are controlled by the most advanced interface by Smart software and Touch-Screen.
Historical cycles data can be stored on the computer or network.
Material quality improvement is evident same as well the cost saving which allows the VLP 5200-5700S to be the most advanced Press in the market.

    • High productivity
    • High dimensional stability
    • Very tight temperature accuracy
    • Small footprint
    • Maintenance friendly
    • Material cost savings
    • ENERGY SAVING
New Software platform Cedatec System© with centralized data-collection (Industry 4.0 complies)

For more information, ask for the datasheet pdf

Related products

VLP 4800M

VLP 7300H

VLP 7300

MLP 25M

MLP 62M

© 2019 Cedatec srl - P. Iva IT03606730129

VLP 7300H

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Green Technology

VLP
7300H

Specially designed for any today needs, Cedatec has developed the NEW GENERATION Vacuum-Lamination-Press VLP 7300H that combines the revolutionary endothermic system for heating up the material along with the innovative heating element technology for keeping top and bottom material temperature uniform.
The pressure is applied by an air-booster system which guarantees a perfect material thickness and planarity.
Heating profile, Pressure, Vacuum and all other lamination process are controlled by the most advanced interface by Smart software and Touch-Screen.
Historical cycles data can be stored on the computer or network.
Material quality improvement is evident same as well the cost saving which allows the VLP 7300H to be the most advanced Press in the market.

  • High productivity
  • High dimensional stability
  • Very tight temperature accuracy
  • Small footprint
  • Maintenance friendly
  • Material cost savings
  • ENERGY SAVING
New Software platform Cedatec System© with centralized data-collection (Industry 4.0 complies)

Related products

VLP 4800M

VLP 5200-5700S

VLP 7300

MLP 25M

MLP 62M

© 2019 Cedatec srl - P. Iva IT03606730129

VLP 4800M

NEVER STOP INNOVATING IMPROVING

Green Technology

VLP
4800M

Specially designed for any today needs, the NEW-Generation Vacuum Lamination Press VLP 4800M combines the revolutionary endothermic system for heating up the stack, along with the innovative heating elements technology for keeping the top and bottom side of the material at the same exact temperature of the stack.
The pressure is applied by an air-booster which guarantees a perfect material thickness and planarity.
Material quality improvement is evident same as the cost saving which bring the VLP 4800M the most advanced Press available in the market.
Heating profile with Pressure, Vacuum and all other cycle Parameters are controlled by computer and Touch-Screen.

  • High productivity
  • High dimensional stability
  • Very tight temperature accuracy
  • Small footprint
  • Maintenance friendly
  • Material cost savings
  • ENERGY SAVING
New Software platform Cedatec System© with centralized data-collection (Industry 4.0 complies)

For more information, ask for the datasheet pdf

Related products

VLP 5200/5700S

VLP 7300H

VLP 7300

MLP 25M

MLP 62M

© 2019 Cedatec srl - P. Iva IT03606730129